3:24
#DCNetwork26: AI-Driven Multi-Die Design
Check out full showcase at: https://ngi.fyi/26DCNetworkAIyt to learn more about data center networking for AI and cloud workloads ...
18:26
The Impact of Multi-Die Systems on Semiconductor Design | Synopsys
This video presents a roundtable discussion among Synopsys experts on multi-die system trends, impact on the semiconductor ...
17:28
How the ASIC Model for IP Can Encourage Multi-Die System Innovation
You scream for IP. I scream for IP. We all scream for IP! In this week's Fish Fry podcast, Manmeet Walia (Synopsys) and I ...
16:03
Chiplets offer unprecedented flexibility in high-performance designs, but they also add new challenges on the verification side.
20:41
Multi-Die Systems Set the Stage for Innovation
So far, the only design teams able to handle multi-die systems are bleeding-edge ones accustomed to breaking new ground with ...
1:34
Arteris Multi-Die Solution Accelerates AI-Driven Silicon Innovation
Advanced semiconductor capabilities are vital for the development of future AI solutions and Arteris' innovative technology plays a ...
13:11
Enabling Early and Fast Thermal Simulation for 3D Multi-Die System Designs - Iyad Rayane, ZUKEN
SemIsrael - The Israeli Semiconductor Portal
As design complexity increases with 3DICs and time-to-market becomes a critical component in the automotive, wearables and ...
3:47
Multi-Die and 3DIC Design | Synopsys
Multi-die design is now being used in various market segments to overcome system challenges. Whether it is used to reduce data ...
0:31
Multi-Die, Flip-Chip & System-in-Package (SiP)
This video features our FuzionSC™ semiconductor platform, demonstrating multi-die, flip-chip, and system-in-package ...
19:43
Putting multiple heterogeneous chips is the way forward for improved performance and more functionality, but it also brings a host ...
29:21
Solving a Perfect Storm of Challenges: How Multi-Die Systems Will Drive Next Generation Semiconducto
This week's podcast is all about multi-die systems! Shekhar Kapoor, Senior Director of Product Management at Synopsys, joins ...
3:40
Achieve 2X Performance When Verifying Multi-Die Systems in Synopsys VCS | Synopsys
Learn about the common challenges faced when verifying multi-die systems and how distributed simulation in Synopsys VCS is ...
2:32
Lightelligence & Synopsys Platform Architect
Hear how Synopsys Platform Architect helped the team accelerate and define their overall multi-die system architecture executing ...
0:59
Faster Heterogeneous Integration with Synopsys Multi-Die System Solution | Synopsys
Change brings opportunities and challenges that force us to grow, innovate, and lead. The industry is transforming from monolithic ...
26:47
Enabling the Era of Multi-Die System with UCIe
... here is to engage early with architecture partitioning and then provide every tool that is required to build a true multi-die system ...
29:14
Designing the Future Today: AI-Driven Multi-Die Design | Synopsys
AI is emerging as a critical enabler for optimizing design, integration, and verification. This keynote explores how AI‑driven ...
2:57
Solving test challenges of multi-die designs with Tessent Multi-die
Tessent Multi-die enables fully automated implementation of DFT for designs that scale sideways (2.5D devices), are stacked on ...
18:03
Implementing DFT in 2 5D 3D designs using Tessent Multi die - Lee Harrison at DAC 2023
Tessent Silicon Lifecycle Solutions
Recorded at DAC 2023. Presenter: Lee Harrison, Director, Product Marketing, Tessent, Siemens EDA. ABOUT TESSENT ...